DTIP 2025 will be the 27th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS This unique event aims to present the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS All aspects including design, modeling, testing, micro machining, integration and packaging of structures, devices and systems will be addressed in a single track Conference After the successful 2024 edition in Dresden, the 2025 edition will take place in the city of Split, Croatia We look forward to meeting you in Split.