INTRODUCTION Issues in Electronics Packaging Design Technical Management Issues Electronics Design Packaging / Enclosure Design Reliability BASIC HEAT TRANSFER: CONDUCTION, CONVECTION AND RADIATION Basic Equations and Concepts General Equations Non Dimensional Groups Nusselt Number Grashof Number Prandtl Number Reynolds Number CONDUCTIVE COOLING Thermal Resistance Sample Problem & Calculations Resistance Network Network Rules Sample Problem & Calculations Comparison with Exact Results Assumptions Temperature at Intermediate Points Exercise: IC Temperature Determination Heat Spreading Thermal Modeling Example Applications Junction-to-Junction Case Resistance Contact Interface Resistance Modeling the Interface Exercise - Calculate the Component Temperature First Approach A Second Approach A Third Approach A Word on Edge Guides 2-D or 3-D Heat Conduction Thermal Conductance Example RADIATION COOLING Factors Influencing Radiation Surface Properties View Factor Calculations View Factor Calculations In Electronics Packages Examples and Illustrations Electronics Packaging Problem Flow in a Vertical Open-ended Channel Cabinet Surface Temperature First Approach Second Approach FUNDAMENTALS OF CONVECTION COOLING Introduction Flow Regimes, Types & Influences Free (or natural) convection Estimates of Heat Transfer Coefficient Solution Procedure High Altitudes Board Spacing & Inlet-Outlet Openings Design Tips Cabinet Interior & Surface Temperature Calculating Surface Temperature Calculation of Internal Temperature Calculation of Component Temperature Fin Design Basic Procedure RF Cabinet Free Convection Cooling Analytical Approach Design Recommendations for This Example. A More Exact Procedure Forced Convection Direct Flow System Design Required Flow Rate Board Spacing & Configurations Flow Resistance Flow Networks Flow Rate Distribution Between Parallel Plates Optimum Board Spacing and Heat flow System''s Impedance Curve Sample Problem Fan-Selection, and Fan Laws Fan Performance Curve Fan Networks More on Fan Performance Curves Fan Laws Component Hot Spot Calculating hc Using Colburn Factor Calculating hc Using Flow Rate In-Direct Flow System Design Resistance Network Representation COMBINED MODES AS WELL AS TRANSIENT HEAT TRANSFER Total System Resistance Time Dependent Temperature Variation Temperature Rise of an Electronic Module BASICS OF VIBRATION AND ITS ISOLATION Periodic and Harmonic Motions Free Vibration First Application Example Second Application Mode Shapes Damped Vibration Impact of Damping Forced Vibration Engineering Applications Dynamic Magnification Factor Transmissibility Phase Angle Vibration Through Base Excitation Example Vibration Isolation Example 1 Example 2 Applications to Electronics Enclosures Maximum Deflection Typical Transmissibility Values in Electronics Enclosures Maximum Desired PCB Deflection Random Vibration Vibration Terminology Peak Value Average Value Mean Square Value Root Mean Square (RMS) Decibel Octave Spectral Density Solution Techniques For Random Vibration Excitation Spectrum Equipment Response Vibrations Due to Acoustics And Noise Multiple Degree of Freedom Systems BASICS OF SHOCK MANAGEMENT Pulse Shock Isolation Example 1 Example 2 System without Isolators System with Isolators Velocity Shock Isolation Example Maximum Desired PCB Deflection Equipment Design INDUCED STRESSES Forced Vibration Sample Problem Random Vibration Probability of Failure Example Shock Environment THE FINITE ELEMENT METHODS Some Basic Definitions THE FINITE ELEMENT ANALYSIS PROCEDURE Finite Element Formulation Formulation of Characteristic Matrix and Load Vector Direct Approach Variational (Energy) Approach Weighted Residual Approach Finite Element Formulation of Dynamic Problems Wave Propagation Type Vibration Type Methods of Solving This Equation: Examp⤠Impact of Boundary Conditions; Uniform Bar Finite Element Formulation of Heat Conduction CAD to FEA Considerations CAD to FEA, Do''s and Do Not''s Criteria for Choosing an Engineering Software What types of Engineering programs are there? Computer Aided Design (CAD) and Computer Aided Manufacturing (CAM) Solid Mechanics and Stress Analysis - FEA Software Fluid Mechanics and Heat Transfer - CFD Software General Physics - CFD and/or FEA Which Software should I choose? Application Complete Package User Interface, Manuals and Training Customer Support Quality Assurance (QA) Maintenance Error R.
Practical Guide to the Packaging of Electronics, Second Edition : Thermal and Mechanical Design and Analysis