Introduction Issues in Electronics Packaging Design Technical Management Issues Basic Heat Transfer--Conduction, Convection, and Radiation Basic Equations and Concepts General Equations Nondimensional Groups Conductive Cooling Introduction Thermal Resistance Heat Spreading Junction-to-Case Resistance Contact Interface Resistance 2D or 3D Heat Conduction Radiation Cooling Introduction Factors Influencing Radiation Examples and Illustrations Cabinet Surface Temperature A Few Design Tips Fundamentals of Convection Cooling Introduction Free (or Natural) Convection Fin Design Forced Convection Indirect Flow System Design Combined Modes, Transient Heat Transfer, and Advanced Materials Introduction Total System Resistance Time-Dependent Temperature Variation Advanced Materials and Technologies Basics of Vibration and Its Isolation Introduction Periodic and Harmonic Motions Free Vibration Forced Vibration Random Vibration Vibrations and Mechanical Stresses Caused by Acoustics and Noise Multiple DOF Systems A Few Words on Advanced and Active Isolation Techniques Basics of Shock Management Introduction Pulse Shock Isolation Velocity Shock Isolation Induced Stresses Introduction Forced Vibration Random Vibration Shock Environment The Finite Element Methods Introduction Some Basic Definitions The FEA Procedure Finite Element Formulation Formulation of Characteristic Matrix and Load Vector Finite Element Formulation of Dynamic Problems Finite Element Formulation of Heat Conduction CAD to FEA Considerations Criteria for Choosing Engineering Software Summary Mechanical and Thermomechanical Concerns Introduction General Stress-Strain Relationship Determining Deformations under Application of General Loads Thermal Strains and Stresses Thermal Strains and Deflections Simplifications (or Making Engineering Assumptions) Acoustics Introduction Noise, Sound, and Their Difference Governing Equations Measurement and Standards Acoustics as a Design Priority Mechanical Failures and Reliability Introduction Failure Modes Life Expectancy Design Life, Reliability, and Failure Rate Electrical Failures and Reliability Introduction Failure Modes and Mechanism Life Expectancy of Electronics Assemblies Design Life, Reliability, and Failure Rate Chemical Attack Failures and Reliability Concerns Introduction Electrochemical Attacks Migration and Electromigration Reliability Models, Predictions, and Calculations Introduction Basic Definitions Reliability Models Device Failure Rate Prediction System Failure Rate Reliability Testing Design Considerations in an Avionics Electronic Package Introduction Design Parameters Analysis Acknowledgment Appendices References rect Flow System Design Combined Modes, Transient Heat Transfer, and Advanced Materials Introduction Total System Resistance Time-Dependent Temperature Variation Advanced Materials and Technologies Basics of Vibration and Its Isolation Introduction Periodic and Harmonic Motions Free Vibration Forced Vibration Random Vibration Vibrations and Mechanical Stresses Caused by Acoustics and Noise Multiple DOF Systems A Few Words on Advanced and Active Isolation Techniques Basics of Shock Management Introduction Pulse Shock Isolation Velocity Shock Isolation Induced Stresses Introduction Forced Vibration Random Vibration Shock Environment The Finite Element Methods Introduction Some Basic Definitions The FEA Procedure Finite Element Formulation Formulation of Characteristic Matrix and Load Vector Finite Element Formulation of Dynamic Problems Finite Element Formulation of Heat Conduction CAD to FEA Considerations Criteria for Choosing Engineering Software Summary Mechanical and Thermomechanical Concerns Introduction General Stress-Strain Relationship Determining Deformations under Application of General Loads Thermal Strains and Stresses Thermal Strains and Deflections Simplifications (or Making Engineering Assumptions) Acoustics Introduction Noise, Sound, and Their Difference Governing Equations Measurement and Standards Acoustics as a Design Priority Mechanical Failures and Reliability Introduction Failure Modes Life Expectancy Design Life, Reliability, and Failure Rate Electrical Failures and Reliability Introduction Failure Modes and Mechanism Life Expectancy of Electronics Assemblies Design Life, Reliability, and Failure Rate Chemical Attack Failures and Reliability Concerns Introduction Electrochemical Attacks Migration and Electromigration Reliability Models, Predictions, and Calculations Introduction Basic Definitions Reliability Models Device Failure Rate Prediction System Failure Rate Reliability Testing Design Considerations in an Avionics Electronic Package Introduction Design Parameters Analysis Acknowledgment Appendices References nt The Finite Element Methods Introduction Some Basic Definitions The FEA Procedure Finite Element Formulation Formulation of Characteristic Matrix and Load Vector Finite Element Formulation of Dynamic Problems Finite Element Formulation of Heat Conduction CAD to FEA Considerations Criteria for Choosing Engineering Software Summary Mechanical and Thermomechanical Concerns Introduction General Stress-Strain Relationship Determining Deformations under Application of General Loads Thermal Strains and Stresses Thermal Strains and Deflections Simplifications (or Making Engineering Assumptions) Acoustics Introduction Noise, Sound, and Their Difference Governing Equations Measurement and Standards Acoustics as a Design Priority Mechanical Failures and Reliability Introduction Failure Modes Life Expectancy Design Life, Reliability, and Failure Rate Electrical Failures and Reliability Introduction Failure Modes and Mechanism Life Expectancy of Electronics Assemblies Design Life, Reliability, and Failure Rate Chemical Attack Failures and Reliability Concerns Introduction Electrochemical Attacks Migration and Electromigration Reliability Models, Predictions, and Calculations Introduction Basic Definitions Reliability Models Device Failure Rate Prediction System Failure Rate Reliability Testing Design Considerations in an Avionics Electronic Package Introduction Design Parameters Analysis Acknowledgment Appendices References and Standards Acoustics as a Design Priority Mechanical Failures and Reliability Introduction Failure Modes Life Expectancy Design Life, Reliability, and Failure Rate Electrical Failures and Reliability Introduction Failure Modes and Mechanism Life Expectancy of Electronics Assemblies Design Life, Reliability, and Failure Rate Chemical Attack Failures and Reliability Concerns Introduction Electrochemical Attacks Migration and Electromigration Reliability Models, Predictions, and Calculations Introduction Basic Definitions Reliability Models Device Failure Rate Prediction System Failure Rate Reliability Testing Design Considerations in an Avionics Electronic Package Introduction Design Parameters Analysis Acknowledgment Appendices References iderations in an Avionics Electronic Package Introduction Design Parameters Analysis Acknowledgment Appendices References.
Practical Guide to the Packaging of Electronics : Thermal and Mechanical Design and Analysis, Third Edition