"Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integration Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive details on RoHS-compliant electronics packaging solder interconnects. This authoritative guide aids in developing innovative, high-performance, cost-effective, and reliable lead-free interconnects for electronics and optoelectronic products. Reliability of RoHS-Compliant 2D and 3D IC Interconnects Covers chip-level interconnect reliability, first- and second-level interconnect reliability, and 3D IC integration interconnect reliability Addresses challenging problems created by increasing interest in lead-free interconnect reliability of 3D packaging and 3D IC integration Provides information fundamental to research and development of design (mechanical, optical, electrical, and thermal); materials; process; manufacturing; testing; and reliability for lead-free interconnects in RoHS-compliant electronics products Removes road blocks to, avoids unnecessary false starts in, and accelerates design, materials, and process development in packaging technology In-depth details: Introduction to RoHS Compliant Semiconductor and Packaging Technologies; Reliability Engineering of Lead-Free Interconnects; Notes on Failure Criterion; Reliability of 1657-Pin CCGA Lead-Free Solder Joints; Reliability of PBGA Lead-Free Solder Joints; Reliability of LED Lead-Free Interconnects; Reliability of VCSEL Lead-Free Interconnects; Reliability of Low-Temperature Lead-Free (SnBiAg) Solder Joints; Reliability of Lead-Free (SACX) Solder Joints; Chip-to-Wafer (C2W) Lead-Free Interconnect Reliability; Wafer-to-Wafer (W2W) Lead-Free Interconnect Reliability; Through-Silicon-Via (TSV) Interposer Lead-Free Interconnect Reliability; Electromigration of Lead-Free Microbumps for 3D IC Integrations; Effects of Dwell-Time and Ramp-Rates on SAC Thermal Cycling Test Results; Effects of High Strain Rate (Impact) on SAC Solder Bumps; Effects of Voids on Solder Joints Reliability"--"Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive coverage of RoHS-compliant electronics packaging solder interconnects. RoHS--the restriction of the use of certain hazardous substances in electrical and electronic equipment--is law in the EU, China, Japan, Korea, Canada, Australia, California, etc. RoHS bans lead and five other materials; thus, in order to ship electrical products to these regions and countries, products must be lead-free. The material in this book aids in developing innovative, high-performance, cost-effective, and reliable lead-free interconnects for electronics and optoelectronic products"--.