Preface 1 5G technology components and material solutions for hardware system integration Abstract 1.1 Evolution of 5G technology 1.2 5G technology components 1.2.1 5G spectrum 1.2.2 Massive multiple input multiple output (MIMO) antennas 1.2.

3 Network slicing 1.2.4 Dual connectivity and Long Term Evolution (LTE) coexistence 1.2.5 Support for cloud implementation and edge computing 1.3 Materials solutions for 5G hardware system integration 1.3.1 Evolution of the cellular base station and its construction materials 1.

3.2 Drivers to 5G hardware system integration 1.3.3 Materials and electronic components for 5G packaging technology 1.3.3.1 Packaging requirements for 5G systems 1.3.

3.2 Dielectric materials for 5G module packages 1.3.3.3 Microwave circuit design and materials 1.3.3.4 Electrically & thermally conductive materials and thermal management for 5G 1.

3.3.5 Integration of passive components 1.3.3.6 Antenna systems in package 1.3.3.

7 High precision patterning in heterogeneous package integration for 5G 1.3.4 Nanomaterials for nanoantennas in 5G 1.4 Challenges in 5G and beyond - 6G 1.5 Outlook and future perspectives References 2 Semiconductor solutions for 5G 2.1 Evolution of 5G semiconductor technologies 2.2 Effect of CMOS technology scaling on mmW operations 2.3 Distributed and lumped design approaches for fabricating passives 2.

3.1 Distributed approach 2.3.2 Lumped approach 2.4 Comparison of silicon and III-V semiconductors 2.5 Transistor model design challenge in CMOS technology 2.6 GaN and GaN-on-SiC wide bandgap semiconductors for 5G applications 2.6.

1 Characteristics of GaN devices applied in 5G technology 2.6.2 GaN power integration for MMIC in 5G technology 2.6.2.1 GaN power integration for MMICS 2.6.2.

2 GaN base station Pas 2.6.2.3 GaN frequency synthesis References 3 Design and performance enhancement for 5G antennas and beamforming integrated circuits Abstract 3.1 5G Antenna classification 3.1.1 Classification based on input and output ports 3.1.

2 Classification based on antenna types 3.2 Performance enhancement techniques for 5G antenna design 3.2.1 General antenna performance enhancement techniques 3.2.2 Mutual coupling reduction (decoupling) techniques 3.3 Structural design and building materials of 5G antennas 3.3.

1 SISO wideband antennas 3.3.2 SISO Multiband antenna 3.3.3 MIMO wideband antennas 3.3.4 MIMO multiband antennas References 4 PCB materials and design requirements for 5G systems Abstract 4.1 The evolution of printed circuit boards 4.

1.1 History 4.1.2 Materials and fabrication process 4.2 RF and high frequency PCB technologies 4.2.1 Basic circuit configuration of high-frequency PCBs 4.2.

2 Transmission line parameters used in RF/high frequency PCB design 4.3 Designing high frequency PCBs 4.3.1 Variables affected the performance of high frequency PCBs 4.3.2 High frequency PCB layout techniques 4.4 Materials selection of PCBs for millimeter wave applications 4.4.

1 High frequency PCB materials selection guidelines 4.4.2 PCB materials used for high frequency applications 4.4.2.1 PCB substrate materials 4.2.2.

2 Conductors for high frequency PCBs 4.5 The role of materials in high frequency PCB fabrication 4.6 Materials issues related to 5G applications 4.6.1 Mixed signal acceptance circuit board designs 4.6.2 EMI shielding challenges 4.6.

3 Impedance control and signal loss 4.6.4 Thermal management challenges 4.6.5 Moisture absorption References 5 Materials for high frequency filters Abstract 5.1 The 5G effect on filter technologies 5.1.1 Current status of mobile device filter technologies 5.

1.2 The 5G filter performance challenges 5.1.2.1 The 5G frequency spectrum 5.1.2.2 The 5G filter requirements 5.

1.2.3 Physical design and emerging solutions for the 5G filters 5.2 Materials and design for acoustic filters 5.2.1 Current application and band allocation of acoustic Filter technology 5.2.2 Basic working principle of BAW filter 5.

2.2.1 Structure of BAW resonator 5.2.2.2 Key parameters of BAW resonator 5.2.2.

3 Topology of BAW filter 5.2.3 Materials for BAW resonator 5.2.3.1 Piezoelectric materials 5.2.3.

2 Electrode materials 5.2.4 Temperature compensation 5.2.5 Frequency tenability 5.2.6 Lithium niobate and laterally-excited bulk-wave resonators 5.3 Microwave and mm-Wave filters based on MEMS technology 5.

3.1 Micromachined filters 5.3.1.1 Surface micromachining superconductor filters 5.3.1.2 Planar microstrip filters 5.

3.1.3 Coplanar waveguide filters 5.3.1.4 Micromachined dielectric waveguide resonate filters 5.3.2 Micromachined tunable filters 5.

4 Metamaterial and metasurface filters for 5G communications References 6 EMI shielding materials and absorbers for 5G communications Abstract 6.1 EMI shielding design principle in 5G systems 6.2 Component package-level EMI shielding for 5G modules 6.3 Board level EMI shielding for 5G systems 6.4 Design and materials selection for 5G absorbers 6.5 Advanced metallic composite materials for high frequency EMI shielding 6.5.1 Hollow and porous metal-based EMI shielding materials 6.

5.2 Metal-based EMI shielding composites with the frequency-selective transmission 6.5.3 Particle-based EMI shielding metallic composites 6.5.4 MXenes based EMI shielding composites.