Advanced materials for printed flexible electronics Preface 1 Fundamentals and design guides for printed flexible electronics Abstract 1.1 Historical perspectives 1.2 Printing requirements for printable materials 1.2.1 Ink formulation 1.2.2 Inks for flexible devices 1.2.
3 Inks for stretchable devices 1.2.4 Inks for self-healing devices 1.2.5 Polymer substrate formulation 1.3 Design guidelines for flexible printed electronics 1.3.1 3D modeling and printing process control 1.
3.2 Design guideline for 3D printing 1.3.3 Materials design for flexible and stretchable electronics 1.4 Fabrication technology for printed flexible electronics 1.4.1 Nozzle-based 3D printing technologies 1.4.
2 Light-based 3D writing technologies 1.4.2.1 Two-photon lithography 1.4.2.2 Projection micro-stereolithography 1.4.
2.3 Continuous liquid interface production 1.4.3 Representative multi-material and hybrid 3D printing processes 1.4.4 Stress-controlled folding of 3D systems 1.4.4.
1 4D printing 1.4.4.2 Micro- and nanoscale origami 1.4.4.3 Mechanically guided assembly References Exercises 2 Process and material characterization in printed flexible electronics Abstract 2.1 Fluid characterization 2.
1.1 Rheology and wetting behavior 2.1.1.1 Viscosity 2.1.1.2 Surface energies and surface tensions 2.
1.1.3 Viscoelasticity 2.1.1.4 Direct imaging 2.1.1.
5 Dynamic measurements 2.1.2 Jet breakup and drop formation 2.1.3 Characteristics of jet fluids with solid fillers 2.1.3.1 Rheology of particle suspensions 2.
1.3.2 Shear thinning fluids 2.1.3.3 Phase-changing inks and three-dimensional printing 2.1.4 Ink drop impact and reaction with substrate 2.
1.4.1 Drop impact on powder and three-dimensional printed structures 2.1.4.2 Drop impact on textile surfaces 2.1.5 Solidification 2.
1.6 Curing and sintering 2.1.6.1 Thermal sintering 2.1.6.2 Electrical sintering 2.
1.6.3 Photonic sintering 2.1.6.4 Microwave sintering 2.2 Solid feedstock materials characterization techniques 2.2.
1 Filament for fused deposition 2.2.1.1 Filament diameter consistency 2.2.1.2 Density 2.2.
1.3 Porosity 2.2.1.4 Moisture content 2.2.1.5 Thermal properties 2.
2.1.6 Microstructure analysis of composite filament 2.2.2 Powder for additive manufacturing processes 2.2.2.1 Powder Morphology 2.
2.2.1.1 Sieve analysis 2.2.2.1.2 Microcopy analysis 2.
2.2.1.3 Laser light diffraction 2.2.2.1.4 Influence of particle size and size distribution on part properties 2.
2.2.1.5 Effect of particle shape and surface roughness 2.2.2.2 Powder chemistry 2.2.
2.2.1 X-ray photoelectron spectroscopy 2.2.2.2.2 Auger electron spectroscopy 2.2.
2.2.3 Energy dispersive X-Ray spectroscopy 2.2.2.2.4 Inductively coupled plasma optical emission spectroscopy 2.2.
2.2.5 Inert gas fusion 2.2.2.2.6 Effect of powder chemistry 2.2.
2.3 Powder microstructure 2.2.2.3.1 Metallography 2.2.2.
3.2 X-ray diffraction 2.2.2.3.3 Thermal analysis methods 2.3 Aerosol jet printing process characterization 2.3.
1 Working principle of aerosol jet printing 2.3.1.1 Atomization approach 2.3.1.2 Materials transport, focusing and deposition 2.3.
2 Aerosol jet printing parameters 2.3.2.1 Sheath and atomizer gas flow 2.3.2.2 Tool path and design rules 2.3.
3 Future aerosol jet printing process modification and application 2.4 Printed thin-film characterization 2.4.1 Optical characterization 2.4.1.1 Optical microscopy 2.4.
1.2 UV-Vis Spectroscopy 2.4.2 Additional surface topography 2.4.2.1 Stylus profilometry 2.4.
2.2 Confocal and white-light microscopy 2.4.2.3 Atomic force microscopy 2.4.3 Electrical conductivity measurement 2.5 Mechanical characterization of printed flexible electronics 2.
5.1 Determining materials constants.