This is an introductory level book on the fundamentals of microelectronics packaging geared toward students, technicians, and electrical and electronic engineers who need a solid reference on the basics of microelectronics packaging and design. Culled from 12 chapters in the 3-volume Microelectronics Packaging Handbook, Third Edition, it is appropriate both as a reference for those already engaged in packaging design, first and second level packages and their interconnections, test, assembly, thermal management, optoelectronics, reliability, and manufacturing.