Wirebonding in Microelectronics Packaging

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Author(s):	Tummala, Rao
ISBN No.:	9780412154812
Pages:	159
Year:	199803
Format:	Trade Paper
Price:	$ 41.33
Dispatch delay:	Dispatched between 7 to 15 days
Status:	Available

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Taken from the 2nd edition of the classic 3-volume Microelectronics Packaging Handbook, this title contains specific, fundamental coverage of microelectronics wirebonding.

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