System on Package : Miniaturization of the Entire System
System on Package : Miniaturization of the Entire System
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Author(s): Tummala, Rao
ISBN No.: 9780071459068
Pages: 785
Year: 200805
Format: Trade Cloth (Hard Cover)
Price: $ 212.52
Dispatch delay: Dispatched between 7 to 15 days
Status: Available

Master the Revolutionary System-on-Package Technology that Places an Entire Electronic System in your Hand System-on-Package (SOP) is an emerging system technology that goes beyond System-on-Chip (SOC) and System-in-Package (SIP) and forms the basis of all emerging digital convergent electronic and bioelectronic systems. Unlike SOC which integrates and miniaturizes 10% of a system, SOP miniaturizes the entire system. It achieves this by package integration with embedded components at microscale in the short term and nanoscale in the long term. Written by the well-known leaders of the team at Georgia Tech that developed the technology, Introduction to System-on-Package (SOP) explains the basics of SOP design, all the system technologies and applications. This first-ever book on SOP shows designers how this revolutionary new packaging technology-which is less costly to design and manufacture, and faster to market than traditional packaging and assembly-answers a wide range of pressing digital convergence challenges. Introduction to System-on-Package (SOP) defines what SOP is and how it differs from the other dominant System-on-Chip and System-in-Package technologies. The authors describe how SOP-based mixed signal systems could be designed, fabricated, tested, and assembled with digital, RF, optoelectronic and biosensor functions. Filled with over 200 helpful illustrations, this landmark resource features: The latest methodologies for convergent systems design Advanced multifunctional materials and their chemical process integration Expert guidance on computing, communication, consumer, and biomedical applications A lucid account of SOP with electrical test, wafer level assembly, and thermal management New information on integration of RF, optical, and digital functions Book jacket.



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