Publications written by: Lau, John H.

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Chiplet Design and Heterogeneous Integration Packaging 9789811999192 Published: 2024 $ 179.39	Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology 9789819721399 Published: 2024 $ 275.99	Chiplet Design and Heterogeneous Integration Packaging 9789811999161 Published: 2023 $ 275.99	Semiconductor Advanced Packaging 9789811613784 Published: 2022 $ 178.26
Semiconductor Advanced Packaging 9789811613753 Published: 2021 $ 249.57	Assembly and Reliability of Lead-Free Solder Joints 9789811539220 Published: 2021 $ 179.39	Assembly and Reliability of Lead-Free Solder Joints 9789811539190 Published: 2020 $ 248.39	Heterogeneous Integrations 9789811372230 Published: 2019 $ 226.08
Heterogeneous Integrations 9789811372261 Published: 2019 $ 165.59	Fan-Out Wafer-Level Packaging 9789811342660 Published: 2018 $ 151.79	Fan-Out Wafer-Level Packaging 9789811088834 Published: 2018 $ 208.69	3D IC Integration and Packaging 9780071848060 Published: 2015 $ 356.61
Solder Joint Reliability 9781461539117 Published: 2014 $ 34.49	Solder Joint Reliability : Theory and Applications 9781461367437 Published: 2014 $ 303.59	Through-Silicon Vias for 3D Integration 9780071785143 Published: 2012 $ 247.02	Reliability of RoHS-Compliant 2D and 3D IC Interconnects 9780071753807 Published: 2010 $ 0.00
Reliability of RoHS-Compliant 2D and 3D IC Interconnects 9780071753791 Published: 2010 $ 263.82	Advanced MEMS Packaging 9780071626231 Published: 2009 $ 247.02	Electronics Manufacturing : With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials 9780071386241 Published: 2002 $ 223.56	Microvias : For Low Cost, High Density Interconnects 9780071363273 Published: 2001 $ 105.41

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