About the Editors xviii About the Contributor xx Preface xxi Acknowledgments xxiii About the Companion Website xxiv 1 Electromagnetic Compatibility 1 1.1 Introduction 1 1.2 Noise and Interference 1 1.3 Designing for Electromagnetic Compatibility 2 1.4 Engineering Documentation and EMC 3 1.5 The Regulatory Process 3 1.6 Typical Noise Path 4 1.7 Methods of Noise Coupling 5 1.
8 Miscellaneous Noise Sources 7 1.9 Use of Network Theory 9 1.10 Summary 11 2 Digital Circuit Grounding 15 2.1 Frequency Versus Time Domain 16 2.2 Analog Versus Digital Circuits 17 2.3 Digital Logic Noise 17 2.4 Internal Noise Sources 18 2.5 Digital Circuit Ground-Return Noise 21 2.
6 Ground-Return Plane Current Distribution and Impedance 27 2.7 Digital Logic Current Flow 44 2.8 Summary 50 3 Signal Integrity for Good EMC 54 3.1 Signal Integrity Parameters 54 3.2 Design Techniques 63 3.3 Effects of Signaling Methods 70 3.4 Summary 73 4 PCB Power Distribution Network Decoupling 75 4.1 Introduction 75 4.
2 PDN Physics for PCB Power Delivery--Current Path, Circuit Model, and PDN Impedance 82 4.3 Inductance Concepts for Multilayer PCB Power Distribution Networks 90 4.4 Capacitors and Interconnects for PCB Power Distribution Networks 96 4.5 Achieving a PCB Target Impedance by Design 101 4.6 PCB PDN Impedance Measurements 107 5 PCB Layout and Stackup 114 5.1 General PCB Layout Considerations 114 5.2 PCB-to-Chassis Ground Connection 116 5.3 Return Path Discontinuities 117 5.
4 PCB Layer Stackup 125 5.5 Summary 142 6 Passive Components 146 6.1 Capacitors 146 6.2 Inductors 152 6.3 Transformers 154 6.4 Resistors 155 6.5 Conductors 158 6.6 Transmission Lines 162 6.
7 Ferrites 170 6.8 Summary 177 7 Balancing and Filtering 181 7.1 Balancing 181 7.2 Filtering 194 7.3 Power Supply Decoupling 198 7.4 Driving Capacitive Loads 204 7.5 System Bandwidth 207 7.6 Modulation and Coding 207 7.
7 Summary 208 8 Cabling 211 8.1 Capacitive Coupling 212 8.2 Effect of Shield on Capacitive Coupling 214 8.3 Inductive Coupling 217 8.4 Mutual Inductance Calculations 219 8.5 Effect of Shield on Magnetic Coupling 221 8.6 Shielding to Prevent Magnetic Radiation 227 8.7 Shielding a Receptor Against Magnetic Fields 229 8.
8 Common Impedance Shield Coupling 230 8.9 Experimental Data 231 8.10 Example of Selective Shielding 234 8.11 Shield Transfer Impedance 235 8.12 Coaxial Cable Versus Twisted Pair 235 8.13 Shielded Parallel Pair Cables 238 8.14 Braided Shields 239 8.15 Spiral Shields 241 8.
16 Shield Terminations 244 8.17 Ribbon Cables 252 8.18 Electrically Long Cables 253 8.19 Summary 254 9 Modeling and Simulation 262 9.1 Introduction 262 9.2 The Finite-Difference Time-Domain Simulation Technique 262 9.3 The Method of Moments Modeling Technique 267 9.4 Finite Element Method 270 9.
5 Simulation Validation 272 9.6 Summary 273 10 Shielding 275 10.1 Near Fields and Far Fields 275 10.2 Characteristic and Wave Impedances 278 10.3 Shielding Effectiveness 279 10.4 Absorption Loss 281 10.5 Reflection Loss 285 10.6 Composite Absorption and Reflection Loss 292 10.
7 Summary of Shielding Equations 293 10.8 Shielding with Magnetic Materials 295 10.9 Experimental Data 297 10.10 Apertures 299 10.11 Waveguide Below Cutoff 310 10.12 Conductive Gaskets 312 10.13 The "Ideal" Shield 316 10.14 Conductive Windows 316 10.
15 Conductive Coatings 317 10.16 Internal Shields 320 10.17 Cavity Resonance 322 10.18 Grounding of Shields 322 10.19 Summary 323 11 Grounding 327 11.1 AC Power Distribution and Safety Grounds 328 11.2 Signal Grounds 338 11.3 Equipment/System Grounding 348 11.
4 Ground Loops 358 11.5 Low-Frequency Analysis of Common-Mode Choke 361 11.6 High-Frequency Analysis of Common-Mode Choke 365 11.7 Single Ground Reference for a Circuit 366 11.8 Summary 367 12 Digital Circuit Radiation 371 12.1 Differential Mode Radiation 371 12.2 Controlling Differential Mode Radiation 377 12.3 Common Mode Radiation 381 12.
4 Controlling Common-Mode Radiation 385 13 Conducted Emissions 394 13.1 Power-Line Impedance 394 13.2 Switched-Mode Power Supplies 397 13.3 Power-Line Filters 409 13.4 Primary-to-Secondary Common-Mode Coupling 417 13.5 Frequency Dithering 419 13.6 Power Supply Instability 419 13.7 Magnetic Field Emissions 420 13.
8 Variable Speed Motor Drives 422 13.9 Harmonic Suppression 427 13.10 Summary 430 14 RF and Transient Immunity 434 14.1 Performance Criteria 434 14.2 RF Immunity 435 14.3 Transient Immunity 446 14.4 Power-Line Disturbances 458 14.5 Summary 461 15 Electrostatic Discharge 465 15.
1 Static Generation 465 15.2 Human Body Model 470 15.3 Static Discharge 473 15.4 ESD Protection in Equipment Design 474 15.5 Preventing ESD Entry 477 15.6 Hardening Sensitive Circuits 488 15.7 ESD Grounding 488 15.8 Non-Grounded Products 489 15.
9 Field-Induced Upset 490 15.10 Transient Hardened Software Design 491 15.11 Time Windows 494 15.12 Summary 495 16 Mixed-Signal PCB Layout 499 16.1 Split Ground Planes 499 16.2 Microstrip Ground Plane Current Distribution 500 16.3 Analog and Digital Ground Pins 503 16.4 When Should Split Ground-Return Planes Be Used? 506 16.
5 Mixed Signal ICs 507 16.6 High-Resolution A/D and D/A Converters 509 16.7 A/D and D/A Converter Support Circuitry 512 16.8 Vertical Isolation 515 16.9 Mixed-Signal Power Distribution 517 16.10 The IPC Problem 519 16.11 Summary 520 17 Precompliance EMC Measurements 523 17.1 Test Environment 523 17.
2 Antennas Versus Probes 524 17.3 Common-Mode Currents on Cables 524 17.4 Near-Field Measurements 527 17.5 Noise Voltage Measurements 531 17.6 Conducted Emission Testing 533 17.7 Spectrum Analyzers 539 17.8 EMC Crash Cart 542 17.9 One-Meter Radiated Emission Measurements 543 17.
10 Precompliance Immunity Testing 547 17.11 Precompliance Power Quality Tests 552 17.12 Margin 555 17.13 Summary 556 Problems 557 References 558 Further Reading 559 Index 560.