Section I: Background and introduction to plasma science 1. Plasma physics and applications 2. Plasma diagnostic theory and methods 3. Modelling of plasma chemistry Section II: Plasma processing: Thin Film Deposition 4. Advanced physical vapor deposition (HiPIMS, etc) 5. Advanced chemical vapor deposition (PE-ALD, etc) 6. A review on plasma enhanced atomic layer deposition for advanced thin film deposition 7. Plasma Jet Deposition 8.
Simulation of plasma model for metallic thin film deposition Section III: Plasma processing: Surface modification of thin films 9. Surface functionalization of narrow bandgap semiconductors 10. Surface functionalization of Si, SiGe, and Ge semiconductors 11. Surface functionalization of wide bandgap semiconductors 12. Surface functionalization of ultra-wide bandgap semiconductors 13. Surface functionalization of advanced polymeric materials 14. Surface functionalization of metallic surface modification Section IV: Thin film etching and other plasma-enabled processes 15. Low temperature plasma etching technology 16.
Etching technology for narrow bandgap semiconductor 17. Etching technology for Si, SiGe, and Ge semiconductor 18. Etching technology for wide bandgap semiconductor 19. Etching technology for ultra-wide bandgap semiconductor 20. Advances of plasma atomic layer etching technology 21. Plasma dicing technology Section V: Energy, sensor and environmental applications of liquid plasma processing 22. Synthesis of semiconductor nanomaterials for energy applications 23. Environmental sensors via liquid plasma processing Section VI: Other advanced (thin film) plasma processing methods 24.
Cold atmospheric plasma 25. Laser induced plasma 26. Plasma for 3D printing 27. Development of advanced plasma technology for semiconductor device thin film applications 28. Advances of plasma etching technology for 3D advanced packaging for high density memory devices Section VII: Plasmas for advanced and thin film characterization techniques 29. Glow Discharge Mass Spectrometry (GD-MS) 30. Glow Discharge Optical Emission Spectroscopy (GD-OES) 31. Inductively Coupled Plasma Mass Spectrometry (ICP-MS) 32.
Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES) Section VIII: Plasma and performance of semiconductor thin film devices 33. Enhancement of device performance with plasma treatment 34. Plasma induced damages and material defects related to device performance 35. Plasma for wafer bonding.