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Reliability Technology for Integrated Circuit Packaging
Reliability Technology for Integrated Circuit Packaging
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Author(s): Zhou, Bin
ISBN No.: 9789819538843
Pages: 510
Year: 202604
Format: Trade Cloth (Hard Cover)
Price: $ 257.06
Dispatch delay: Dispatched between 7 to 15 days
Status: Available (Forthcoming)

Overview of Integrated Circuit Packaging Technology and Reliability.- Physical Properties and Reliability Characteristics of Integrated Circuit Packaging.- Failure Modes, Mechanisms, and Reliability of Plastic Packaging.- Failure Modes, Failure Mechanism and Reliability of Hermetic Packaging.- Failure Modes, Mechanisms, and Reliability of 3D Packaging.- Thermal Performance and Analysis Techniques of Integrated Circuit Packaging.- Mechanical Characteristics and Tests of Integrated Circuit Packaging.- Failure Analysis Techniques for Integrated Circuit Packaging.


- Quality and Reliability Assurance in Integrated Circuit Packaging- Reliability of Integrated Circuit Board-level Assembly.


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Browse Subject Headings