Preface 1 Introduction to Device and Systems Packaging Technologies 1.1 What Is Packaging and Why? 1.1.1 What Is Packaging? 1.1.2 Why Is Packaging Important? 1.1.3 Every IC and Device Has to Be Packaged 1.
1.4 Controls Performance of Computers 1.1.5 Controls Size of Consumer Electronics 1.1.6 Controls Reliability of Electronics 1.1.7 Controls Cost of Electronic Products 1.
1.8 Required in Nearly Everything 1.2 Anatomy of an Electronic Packaged System from a Packaging Point of View 1.2.1 Fundamentals of Packaging 1.2.2 Systems Packaging Involves Electrical, Mechanical, and Materials Technologies 1.2.
3 Nomenclature 1.3 Devices and Moore''s Law 1.3.1 On-Chip Interconnections 1.3.2 Interconnect Materials 1.3.3 The Resistance and Capacitance Delays (RC Delays) of On-Chip Interconnects 1.
3.4 Future of Device Scaling 1.4 Electronic Technology Waves: Microelectronics, RF/Wireless, Photonics, MEMS, and Quantum Devices 1.4.1 Microelectronics: The First Technology Wave 1.4.2 RF and Wireless: The Second Technology Wave 1.4.
3 Photonics: The Third Technology Wave 1.4.4 Micro-Electro-Mechanical Systems (MEMS): The Fourth Technology Wave 1.4.5 Quantum Devices and Computing: Fifth Wave 1.5 Packaging and Moore''s Law for Packaging 1.5.1 Three Eras in Packaging 1.
5.2 Moore''s Law or SOC Era (1960-2010) 1.5.3 Moore''s Law for Packaging Era from 2010 to 2025 1.5.4 Moore''s Law for Systems Era from 2025 1.6 Electronic Systems Technologies Trends 1.6.
1 Core Packaging Technologies 1.6.2 Packaging Technologies and Their Trends 1.7 Future Outlook 1.7.1 Emerging Computing Systems 1.7.2 Emerging 3D Systems Packaging 1.
8 How the Book Is Organized 1.9 Homework Problems 1.10 Suggested Reading Part 1 Fundamentals of Packaging 2 Fundamentals of Electrical Design for Signals, Power, and Electromagnetic Interference 2.1 What Is Electrical Package Design and Why? 2.2 Electrical Anatomy of a Package 2.2.1 Fundamentals of Electrical Package Design 2.2.
2 Nomenclature 2.3 Signal Distribution 2.3.1 Devices and Interconnections 2.3.2 Kirchhoff''s Laws and Transit Time Delay 2.3.3 Transmission Line Behavior of Interconnections 2.
3.4 Characteristic Impedance 2.3.5 Typical Transmission Line Structures Used as Package Interconnections 2.3.6 Transmission Line Losses 2.3.7 Crosstalk 2.
4 Power Distribution 2.4.1 Power Supply Noise 2.4.2 Inductive Effects 2.4.3 Effective Inductance 2.4.
4 Effect of Package Design on Inductance 2.4.5 Decoupling Capacitors 2.5 Electromagnetic Interference 2.6 Summary and Future Trends 2.7 Homework Problems 2.8 Suggested Reading 3 Fundamentals of Thermal Technologies 3.1 What Is Thermal Management and Why? 3.
2 Anatomy of a Thermal Package System 3.2.1 Fundamentals of Heat Transfer 3.2.2 Nomenclature 3.3 Chip Level Thermal Technologies 3.3.1 Thermal Interface Materials (TIMs) 3.
3.2 Heat Spreaders 3.3.3 Thermal Vias 3.4 Module Level Thermal Technologies 3.4.1 Heat Sinks 3.4.
2 Heat Pipes and Vapor Chambers 3.4.3 Closed-Loop Liquid Cooling 3.4.4 Cold Plates 3.4.5 Immersion Cooling 3.4.
6 Jet Impingement Cooling 3.4.7 Spray Cooling 3.5 System Level Thermal Technologies 3.5.1 Air Cooling 3.5.2 Hybrid Cooling 3.
5.3 Immersion Cooling 3.6 Power and Cooling Technologies for Electric Vehicles 3.7 Summary and Future Trends 3.8 Homework Problems 3.9 Suggested Reading 4 Fundamentals of Thermo-Mechanical Reliability 4.1 What Is Thermo-Mechanical Reliability? 4.2 Anatomy of a Package with Failures and Failure Mechanisms 4.
2.1 Fundamentals of Thermo-Mechanical Reliability 4.2.2 Thermo-Mechanical Modeling 4.2.3 Nomenclature 4.3 Types of Thermo-Mechanical-Induced Failures and Design Guidelines for Reliability 4.3.
1 Fatigue Failures 4.3.2 Brittle Fractures 4.3.3 Creep-Induced Failures 4.3.4 Delamination-Induced Failures 4.3.
5 Plastic Deformation Failures 4.3.6 Warpage-Induced Failures 4.4 Summary and Future Trends 4.5 Homework Problems 4.6 Suggested Reading 5 Fundamentals of Package Materials at Microscale and Nanoscale 5.1 What Is the Role of Materials in Packaging? 5.2 Anatomy of a Package with a Variety of Materials 5.
2.1 Fundamentals of Package Materials 5.2.2 Nomenclature 5.3 Package Materials, Processes, and Properties 5.3.1 Substrate Materials, Processes, and Properties 5.3.
2 Interconnection and Assembly Materials, Processes, and Properties 5.3.3 Passive Component Materials, Processes, and Properties 5.3.4 Thermal and Thermal Interface Materials (TIMs), Processes, and Properties 5.4 Summary and Future Trends 5.5 Homework Problems 5.6 Suggested Reading 6 Fundamentals of Ceramic, Organic, Glass, and Silicon Package Substrates 6.
1 What Is a Package Substrate and Why? 6.2 Anatomy of Three Package Substrates: Ceramics, Organic Laminates, and Silicon 6.2.1 Fundamentals of Package Substrates 6.2.2 Nomenclature 6.3 Package Substrate Technologies 6.3.
1 Historical Trends 6.4 Thick-Film Substrates 6.4.1 Ceramic Substrates 6.5 Thin-Film Substrates 6.5.1 Organic Substrates 6.5.
2 Glass Substrates 6.6 Ultra-Thin-Film Substrates with Semiconductor Packaging Processes 6.6.1 Silicon Substrates 6.7 Summary and Future Trends 6.8 Homework Problems 6.9 Suggested Reading 7 Fundamentals of Passive Components and Integration with Active Devices 7.1 What Are Passive Components and Why? 7.
2 Anatomy of Passive Components 7.2.1 Fundamentals of Passive Components 7.2.2 Nomenclature 7.3 Passive Component Technologies 7.3.1 Discrete Passives 7.
3.2 Integrated Passive Devices (IPDs) 7.3.3 Embedded Discrete Passives 7.3.4 Embedded Thin-Film Passives 7.4 Functional Modules with Passives and Actives 7.4.
1 RF Modules 7.4.2 Power Modules 7.4.3 Voltage Regulator Power Modules 7.5 Summary and Future Trends 7.6 Homework Problems 7.7 Suggested Reading 8 Fundamentals of Chip-to-Package Interconnections and Assembly 8.
1 What Are Chip-to-Package Interconnections and Assembly and Why? 8.2 Anatomy of an Interconnection and Assembly 8.2.1 Types of Chip-Level Interconnections and Assembly Technologies 8.2.2 Fundamentals of Interconnections and Assembly 8.2.3 Fundamentals of Assembly and Bonding 8.
2.4 Nomenclature 8.3 Interconnection and Assembly Technologies 8.3.1 Evolution 8.4 Interconnections and Assembly Technologies 8.4.1 Wire-Bonding 8.
4.2 Tape Automated Bonding (TAB) 8.4.3 Flip-Chip Interconnection and Assembly Technology 8.4.4 Copper Pillar with Solder Cap Technology 8.4.5 SLID Interconnection and Assembly Technology 8.
5 Future Trends in Interconnection and Assembly Technologies 8.5.1 Extension of SLID 8.6 Homework Problems 8.7 Suggested Reading 9 Fundamentals of Embedded and Fan-Out Packaging 9.1 What Is Embedding and Fan-Out Packaging and Why? 9.1.1 Why Embedding and Fan-Out Packaging? 9.
2 Anatomy of a Fan-Out Wafer-Level Package (FO-WLP) 9.2.1 A Typical Fan-Out Wafer-Level Package Process 9.2.2 Fundamentals of Fan-Out Wafer-Level Package Technology 9.2.3 Nomenclature 9.3 Fan-Out Wafer-Level Package Technologies 9.
3.1 Types 9.3.2 Materials and Processes 9.3.3 Fan-Out Wafer-Level Packaging Tools 9.3.4 Challenges in Fan-Out Wafer-Level Packaging Technology 9.
3.5 Applications of Fan-Out Wafer-Level Packaging 9.4 Panel-Level Package (PLP) 9.4.1 What Is Panel-Level Packaging and Why? 9.4.2 Types of Manufacturing Infrastructure for Panel-Level Packaging 9.4.
3 Applications of Panel-Level Packaging 9.5 Summary and Future Trends 9.6 Homework Problems 9.7 Suggested Reading 10 Fundamentals of 3D Packaging with and without TSV 10.1 What Are 3D ICs with TSV and Why? 10.1.1 Why 3D ICs with TSVs? 10.2 Anatomy of a 3D Package with TSV 10.
2.1 Fundamentals of 3D ICs with TSV 10.2.2 Nomenclature 10.3 3D ICs with TSV Technologies 10.3.1 Through-Silicon-Vias (TSVs) 10.3.
2 Ultra-Thin ICs 10.3.3 Back-End-of-Line (BEOL) RDL Wiring 10.3.4 Chip-to-Chip Interconnections within the 3D Stack 10.3.5 Packages for 3D IC Stacks 10.3.
6 Underfill 10.4 Summary and Future Trends 10.5 Homework Problems 10.6 Suggested Reading 10.7 Acknowledgment 11 Fundamentals of RF and Millimeter-Wave Packaging 11.1 What Is RF and Why? 11.1.1 History and Evolution 11.
1.2 When Was the First Mobile Phone Introduced? 11.2 Anatomy of an RF System 11.2.1 Fundamentals of RF 11.2.2 RF Nomenclature 11.3 RF Technologies and Applications 11.
3.1 Transceiver 11.3.2 Transmitter 11.3.3 Receiver 11.3.4 Modulation Schemes 11.
3.5 Antenna 11.3.6 Components in RF Front-End Module 11.3.7 Filters 11.3.8 RF Materials and Components 11.
3.9 RF Modeling and Characterization Techniques 11.3.10 Applications of RF 11.4 What Is a Millimeter-Wave System? 11.5 Anatomy of a Millimeter-Wave Package 11.5.1 Fundamentals of Millimeter-Wave Packaging 11.
6 Millimeter-Wave Technologies and Applications 11.6.1 5G and Beyond 11.6.2 Automotive Radars 11.6.3 Millimeter-Wave Imaging 11.7 Summary and Future Trends 11.
8 Homework Problems 11.9 Suggested Reading 12 Fundamentals of Optoelectronics Packaging 12.1 What Is Optoelectronics? 12.2 Anatomy of an Optoelectronics System 12.2.1 Fundamentals of Optoelectronics 12.2.2 Nomenclature 12.
3 Optoelectronic Technologies 12.3.1 Active Optoelectronic Devices 12.3.2 Passive Optical Devices 12.3.3 Optical Interconnections 12.4 Optoelectronic Systems, Applications, and Markets 12.
4.1 Optoelectronic Systems 12.4.2 Applications of Optoelectronics 12.4.3 Optoelectronics Markets 12.5 Summary and Future Trends 12.6 Homework Problems 12.
7 Suggested Reading 13 Fundamentals of MEMS and Sensor Packaging 13.1 What Are MEMS? 13.1.1 Historical Evolution 13.2 Anatomy of a MEMS Package 13.2.1 Fundamentals of MEMS Packaging 13.2.
2 Nomenclature 13.3 MEMS and Sensor Device Fabrication Technologies 13.3.1 Photolithographic Pattern Transfer 13.3.2 Thin-Film Deposition 13.3.3 Wet and Dry Etching 13.
3.4 Bulk and Surface Micromachining of Silicon 13.3.5 Wafer Bonding 13.3.6 Laser Micromachining 13.3.7 Process Integration 13.
4 MEMS Packaging Technologies 13.4.1 MEMS Package Materials 13.4.2 MEMS Package Assembly Processes 13.5 Application of MEMS and Sensors 13.5.1 Pressure Sensors 13.
5.2 Accelerometers and Gyroscopes 13.5.3 Projection Displays 13.6 Summary and Fu.