Overview of Works xv Acknowledgments xvii 1 Physical Basis of Thermal Conduction 1 Xian Zhang, Ping Zhang, Chao Xiao, Yanyan Wang, Xin Ding, Xianglan Liu, and Xingyou Tian 1.1 Basic Concepts and Laws of Thermal Conduction 1 1.1.1 Description of Temperature Field 1 1.1.2 Temperature Gradient 2 1.1.3 Fourier''s Law 2 1.

1.4 Heat Flux Density Field 2 1.1.5 Thermal Conductivity 3 1.2 Heat Conduction Differential Equation and Finite Solution 3 1.2.1 Heat Conduction Differential Equation 3 1.2.

2 Definite Conditions 5 1.3 Heat Conduction Mechanism and Theoretical Calculation 5 1.3.1 Gases 6 1.3.2 Solids 6 1.3.2.

1 Metals 6 1.3.2.2 Inorganic Nonmetals 8 1.3.3 Liquids 11 1.4 Factors Affecting Thermal Conductivity of Inorganic Nonmetals 12 1.4.

1 Temperature 12 1.4.2 Pressure 13 1.4.3 Crystal Structure 14 1.4.4 Thermal Resistance 14 1.4.

5 Others 15 References 15 2 Electronic Packaging Materials for Thermal Management 19 Xian Zhang, Ping Zhang, Chao Xiao, Yanyan Wang, Xin Ding, Xianglan Liu, and Xingyou Tian 2.1 Definition and Classification of Electronic Packaging 19 2.1.1 Definition of Electronic Packaging 19 2.1.2 Functions of Electronic Packaging 20 2.1.3 The Levels of Electronic Packaging 21 2.

2 Thermal Management in Electronic Equipment 22 2.2.1 Thermal Sources 22 2.2.2 Thermal Failure Rate 23 2.2.3 The Thermal Management at Different Package Levels 23 2.3 Requirements of Electronic Packaging Materials 24 2.

3.1 Thermal Interface Material 24 2.3.2 Heat Dissipation Substrate 25 2.3.3 Epoxy Molding Compound 26 2.4 Electronic Packaging Materials 27 2.4.

1 Metal Matrix Packaging Materials 27 2.4.2 Ceramic Matrix Packaging Materials 30 2.4.3 Polymer Matrix Packaging Materials 33 2.4.4 Carbon-Carbon Composite 36 References 36 3 Characterization Methods for Thermal Management Materials 39 Kang Zheng and Xingyou Tian 3.1 Overview of the Development of Thermal Conductivity Test Methods 39 3.

2 Test Method Classification and Standard Samples 40 3.2.1 Steady-State Measurement Method 41 3.2.2 Non-Steady-State Measurement Method 42 3.3 Steady-State Method 42 3.3.1 Longitudinal Heat Flow Method 43 3.

3.2 Guarded Heat Flow Meter Method 44 3.3.3 Guarded Hot Plate Method 44 3.4 Non-Steady-State Method 46 3.4.1 Laser Flash Method 46 3.4.

2 Hot-Wire Method 46 3.4.3 Transient Planar Heat Source (TPS) Method 47 3.5 Electrical Properties and Measurement Techniques 48 3.5.1 Electric Conductivity and Resistivity 49 3.5.1.

1 Testing Resistivity of Bulk Material 50 3.5.1.2 Four-Probe Method 50 3.5.1.3 The Van der Pauw Method 51 3.5.

2 Dielectric Constant and Its Characterization 52 3.6 Material Characterization Analysis Technology 54 3.6.1 Optical Microscope 54 3.6.2 X-ray Diffraction 55 3.6.2.

1 Phase Analysis 56 3.6.2.2 Determination of Crystallinity 56 3.6.2.3 Precise Measurement of Lattice Parameters 56 3.6.

3 Scanning Electron Microscope 57 3.6.4 Transmission Electron Microscope 58 3.6.5 Scanning Acoustic Microscope 60 3.6.6 Atomic Force Microscope 62 3.6.

7 Thermal Mechanical Analysis (TMA) 64 3.6.8 Dynamic Mechanical Analysis (DMA) 66 3.7 Reliability Analysis and Environmental Performance Evaluation 68 3.7.1 Failure Modes and Mechanisms 69 3.7.1.

1 Residual Stress 69 3.7.1.2 Stress Void 70 3.7.1.3 Adherence Strength 70 3.7.

1.4 Moisture 70 3.7.2 Reliability Certification 71 3.7.2.1 Viscosity of Plastic Packaging Material 71 3.7.

2.2 The Moisture Test 71 3.7.2.3 Hygroscopic Strain and Humidity Measurement 72 3.7.2.4 Temperature Adaptability 72 3.

7.2.5 Tightness 72 3.7.2.6 Defects in Manufacturing Process Control 72 3.7.2.

7 Quality Control Procedure for High-Reliability Plastic Packaging Devices 73 3.7.2.8 Selection of High-Reliability Plastic Packaging Devices 73 3.8 Conclusion 73 References 74 4 Construction of Thermal Conductivity Network and Performance Optimization of Polymer Substrate 77 Hua Wang, Xingyou Tian, Haiping Hong, Hao Li, Yanyan Liu, Xiaoxiao Li, Yusheng Da, Qiang Liu, Bin Yao, Ding Lou, Mingyang Mao, and Zhong Hu 4.1 Synthesis and Surface Modification of High Thermal Conductive Filler and the Synthesis of Substrates 77 4.1.1 Synthesis of Hexagonal Boron Nitride Nanosheets by Halide-Assisted Hydrothermal Method at Low Temperature 77 4.

1.2 Modification and Compounding of Inorganic Thermal Conductive Silicon Carbide Filler 77 4.1.3 Preparation and Characterization of Intrinsic Polymer with High Thermal Conductivity 78 4.2 Study on Polymer Thermal Conductive Composites with Oriented Structure 80 4.2.1 Epoxy Composites Filled with Boron Nitride and Amino Carbon Nanotubes 80 4.2.

2 Reduction of Graphene Oxide by Amino Functionalization/Hexagonal Boron Nitride 84 4.2.3 The Interconnection Thermal Conductive Network of Three-Dimensional Staggered Boron Nitride Sheet/Amino-Functionalized Carbon Nanotubes 87 4.3 Preparation of Thermal Conductive Composites with Inorganic Ceramic Skeleton Structure 88 4.3.1 Preparation of Hollow Boron Nitride Microspheres and Its Epoxy Resin Composite 88 4.3.2 Three-Dimensional Skeleton and Its Epoxy Resin Composite 93 4.

4 Improved Thermal Conductivity of Fluids and Composites Using Boron Nitride Nanoparticles Through Hydrogen Bonding 100 4.4.1 Preparation and Characterization of Improved Thermal Conductivity of Fluids and Composites Using Boron Nitride Nanoparticles 100 4.4.2 Discussion and Analysis of BN Composites as Thermal Interface Materials 102 4.5 Improved Thermal Conductivity of PEG-Based Fluids Using Hydrogen Bonding and Long Chain of Nanoparticle 107 4.5.1 Preparation and Characterization of Thermal Conductivity of PEG-Based Fluids Using Hydrogen Bonding and Long Chain of Nanoparticle 107 4.

5.2 Discussion and Analysis of PEG-Based Fluids Using Hydrogen Bonding and Long Chain of Nanoparticle 109 4.6 Conclusion 114 References 114 5 Optimal Design of High Thermal Conductive Metal Substrate System for High-Power Devices 117 Hong Guo, Zhongnan Xie, and DingBang Xiong 5.1 Power Devices and Thermal Conduction 117 5.2 Optimization and Adaptability Design, Preparation and Modification of High Thermal Conductive Matrix and Components 120 5.2.1 Preparation and Thermal Conductivity of Gr/Cu Composites 120 5.2.

1.1 Gr/Cu In Situ Composite Method 121 5.2.1.2 Thermal Conductivity of Gr/Cu Micro-Nano-Laminated Composites 124 5.2.1.3 Coefficient of Thermal Expansion of Composite Materials 126 5.

2.2 Preparation and Thermal Conductivity of Graphite/Cu Composites 130 5.2.2.1 Variations in the Intrinsic Thermophysical Properties of Graphite Sheets During the Compounding Process 131 5.2.2.2 Orientation Modulation of Graphite Sheets in Composites 133 5.

2.2.3 Effect of Graphite Sheet Orientation on the Thermal Conductivity of Graphite/Cu Composites 136 5.2.3 Preparation and Thermal Conductivity of Graphite/Gr/Cu Composites 136 5.2.3.1 Thermal Conductivity of Graphite/Gr/Cu Composites 140 5.

2.3.2 Thermal Expansion Coefficient of Graphite/Gr/Cu Composites 141 5.3 Formation and Evolution Rules of High Thermal Conductive Interface and Its Control Method 143 5.3.1 Theoretical Calculation of High Thermal Conductive Interface Design 143 5.3.2 Study on Interface Regulation of Chromium-Modified Diamond/Cu Composites 146 5.

3.3 Study on Interface Regulation of Boron-Modified Diamond/Cu Composites 150 5.3.4 Study on Interface Regulation of Gr-Modified Diamond/Cu Composites 153 5.4 Formation and Evolution Rules of High Thermal Conductive Composite Microstructure and Its Control Method 157 5.4.1 Configurated Diamond/Metal Composites with High Thermal Conductivity 157 5.4.

2 Effect of Secondary Diamond Addition on Properties of Composites 159 5.4.3 Effect of Secondary Particle Size on the Properties of Composites 160 5.4.4 Thermal Expansion Behavior of Composite Materials with Different Thermal Conductive Configurations 161 References 162 6 Preparation and Performance Study of Silicon Nitride Ceramic Substrate with High Thermal Conductivity 165 Yao Dongxu, Wang Weide, and Zeng Yu-ping 6.1 Rapid Nitridation of Silicon Compact 165 6.1.1 Rapid Nitridation of Silicon Compact 165 6.

1.1.1 Optimization (YEu)2O3 /MgO Sintering Additive 167 6.1.1.2 Further Optimization of the SRBSN with 2YE5M as Sintering Additive 173 6.2 Optimization of Sintering Aids for High Thermal Conductivity Si3N4 Ceramics 181 6.2.

1 Preparation of High Thermal Conductivity Silicon Nitride Ceramics Using ZrSi2 as a Sintering Aid 182 6.2.1.1 Reaction Mechanism of ZrSi2 182 6.2.1.2 Effect of ZrSi2 on the Phase Composition 185 6.2.

1.3 Effect of ZrSi2 on Microstructure 186 6.2.1.4 Effect of ZrSi2 on Thermal Conductivity 188 6.2.1.5 Effect of ZrSi2 on Mechanical Properties and Electrical Resistivity 189 6.

2.2 High Thermal Conductivity Si3N4 Sintered with YH2 as Sintering Aid 190 6.2.2.1 Pre-sintering of the Compact 191 6.2.2.2 Effect of YH2 on the Densification and Weight Loss 194 6.

2.2.3 Effect of YH2 on Elements Di.